HUMMINK - Pioneer in semiconductor manufacturing solutions

Applications

Opening up to a wider range of manufacturing perspectives.

DISPLAY

SENSORS

PHOTONICS

LUXURY

PACKAGING

Boosting the semiconductor industry.

The semiconductor industry is the physical engine of growing digital applications: AI, Cloud, 5G, quantum, microLED, space.
But the industry is mostly held back by a manufacturing challenge: assembling ever more complex and miniaturized components.

Hummink has been collaborating with world-renowned industrial R&D partners to adress these challenges with concrete applications.

CEA Leti is a key European player in research, development and innovation in the semiconductor industry.
Together, we have been developing new solutions for advanced packaging and transparent conductive oxydes manufacturing.

CNES is the French National Center of Space Studies. It guides innovations for the aerospace and defense industries.
We have been collaborating on micro-electronics applications (sensors, interconnects, etc.)

Itodys Lab from Université Paris Cité is a printed electronics specialist with deep industrial connections.
Collaborating on printed electronic topics (graphene transistors, bio-sensors, nano-catalysts), and acquirers of the 1st Nazca machine in 2022.

Unique Patentend Technology

The future is driven by nano-electronic objects, designed with growing complexity
and continual miniaturization. But the thing is: no one can assemble them.

Our Use Cases

Illustrative scenarios that spotlight the practical application and
transformative potential of our technology.

DISPLAY REPAIR

Motivation

Industry is looking to technical solutions able to repair new generation of thin film transistors (TFT) and color converters with high precision at micron scale. Conventional methods, as inkjet and laser repair, are failing at this scale.

HPCAP Benefit

HPCAP printing is the perfect solution to repair displays with high precision, as it fully removes satellite drops and particles generated by inkjet and laser technologies.

Inks: metals, color inks, polymers, quantum dots

SENSORS

Motivation

Electrolyte-gated organic field effect transistors (EGOFET) is the ideal technology to detect molecules in liquid media. To meet biosensor specifications, the distance between electrodes has to be reduced to improve signal output.

HPCAP Benefit

HPCAP printing represents a highly cost-effective, user-friendly and versatile method for the fabrication of superior EGOFETs, with an excellent signal output and a sub micron distance between electrodes.

Inks: metals, polymers, nanowires

PACKAGING

Motivation

High aspect ratio microbumps with diameters less than 5 µm are required to reach high density pixels and to reduce pixel-to-pixel coupling noise. Those dimensions are not available using conventional technologies.

HPCAP Benefit

High density and aspect ratio microbumps are manufactured in one step, with a perfect control of bumps dimension and shape.

Inks: metals, polymers

PHOTONICS

Motivation

As a highly customizable additive manufacturing method, printing enables a high degree of freedom in testing ideas and concepts for new devices by varying design parameters. Waveguides have proved difficult to create with inkjet printing methods, because of their limited precision and satellite drops.

HPCAP Benefit

Hummink technology is able to print the most complex patterns with high precision at sub-micron scale.

Inks: polymers

LUXURY/ACCESSORIES

Motivation

Watchmaking industry is actively looking to print ultra-thin polymers, able to survive to very aggressive chemical and mechanical environments.

HPCAP Benefit

Hummink technology delivers high precision printing for a wide range of inks, including high viscosity (up to 100,000 cP) and polymer-based chemistries.

Inks: polymers, color inks