📢 PRESS RELEASE — SERIES B FUNDING ANNOUNCEMENT — NOVEMBER 2025

Real-time microscopic repair: the next breakthrough in semiconductor yield

Redefining yield improvement through real-time microscopic repair.

How can manufacturers enhance precision and minimize losses as technologies continue to shrink?

Hummink’s High-Precision Capillary Printing (HPCaP) repairs, functionalizes, and decorates components at the micron scale — meeting the performance and sustainability challenges of modern industries.

Our patented micro-printing technology acts like the world’s smallest fountain pen, capable of depositing materials with sub-micron accuracy. Master the material in your processes, focus on improving semiconductor manufacturing yield, and repair microscopic defects in real time. Power the next generation of chips and displays — and design the future of nanoelectronic devices with Hummink.

+10%
Yield Improvement
-30%
Material Waste
<2s
Per Defect
€15M
Series B Funding Round
KBC Focus Fund
Bpifrance Deeptech
Elaia
Cap Horn
BEI

Transform your semiconductor yield today

Discover how HPCaP technology can revolutionize your production line

A €15M funding round to bring precision to advanced manufacturing

This funding round comes at a pivotal moment, as the semiconductor industry faces unprecedented pressure to improve yields amid soaring AI chip demand, rising fab costs (>$20B per leading-edge facility), and tightening sustainability regulations.

hummink

As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-dollar problems. Each defect at the sub-micron scale can derail an entire batch of chips or displays.

This funding round highlights the strategic importance of precision manufacturing for the semiconductor and display industries, where even minor defects can have a significant economic impact.

This new investment validates a key industrial need: addressing microscopic flaws that cause billions of dollars in losses across global semiconductor fabrication facilities (fabs).

To improve the yield of semiconductors, sensors, and chips, Hummink has raised €15 million to deploy its patented High-Precision Capillary Printing (HPCaP) technology.

The goal is to print functional materials on any substrate and repair microscopic defects in real-time in advanced manufacturing.

This innovative project addresses a global industrial challenge and is supported by leading investors — KBC Focus Fund, Bpifrance Deeptech Ventures, Elaia, Cap Horn, and BEI.

"Our mission is to bring precision where it has never been possible before."

Why has semiconductor yield improvement become a billion-euro challenge?

Micro-defects cost the electronics industry billions of euros. Up to 30% of OLED screens produced each year are rejected, resulting in approximately €16 billion in losses, enough wasted material to cover 6,000 football fields. All it takes is an open circuit, dead pixels, or a dark spot on a panel to compromise quality.

30%
OLED screens rejected annually
€16B
Annual losses in displays
3nm
Node size challenges

Traditional repair methods remain the workhorse of electronics production, but even the best processes generate flaws that lead to yield losses and material waste. In comparison, Hummink’s printing tools act as surgical instruments at the micronic level, complementing lithography by identifying and correcting those flaws in semiconductor packaging interconnects. The result is higher output, lower scrap rates, and reduced environmental impact across the industry.

With the explosion of AI chip demand, yield improvement has become a critical economic imperative—delivering higher output, lower costs, and reduced waste in advanced manufacturing.

The High-Precision Printing that repairs microscopic defects in real time

hummink

Hummink’s patented High-Precision Capillary Printing (HPCaP) technology works like the world’s smallest fountain pen, enabling the localised deposition of conductive or functional materials with sub-micron accuracy directly onto semiconductor packaging interconnects and display components.

Key performance metrics:

Resolution
50µm to 200nm
Repair speed
<2 seconds per defect
Yield improvement
+10% demonstrated in OLED production
Material waste reduction
-30% on average
Integration time
Compatible with existing workflows

High-Precision Capillary Printing (HPCaP) leverages direct-write additive manufacturing. It uses a micropen that prints your patterns in a single step with a resolution from 50µm to a few hundred nanometres, on a wide range of substrates (metal, plastic, glass, paper, etc.), including flexible, curved, or 3D surfaces, making it ideal for high-precision electronics.

Discover the world’s smallest fountain pen capable of repairing micro-defects in under 2 seconds per defect, or improving semiconductor packaging and next-generation memory, directly on your production line. Fully modular, it integrates seamlessly into your existing processes.

Solving microscopic defects: a shared challenge across industries

Precision drives progress in advanced electronics. Hummink’s HPCaP technology improves semiconductor packaging manufacturing yield and enhances production efficiency in next-generation displays.

Because even the slightest defect on a screen or circuit can be fatal, industries require reliable and adaptable repair technologies.

Micro-printing has the advantage of versatility — it offers unparalleled design freedom and compatibility with multiple inks and substrates, including paper, plastic, aluminum foil, metal, and glass.

Concrete examples:

📦
Advanced Packaging
enable 3D stacking and chiplet integration with precision interconnects at the sub-micron level.
💡
Photonics
fine optical adjustments on integrated photonic circuits without damaging sensitive layers.
🚗
Automotive Electronics
repair microscopic defects in ADAS sensors and LiDAR components, where reliability is mission-critical.
💾
Next-Gen Memory
support the development of emerging memory technologies (MRAM, ReRAM) requiring ultra-precise material deposition.

Additionally, our integrated AI tools continually enhance your system, featuring intelligent trajectory plotting, advanced image recognition, and ink monitoring. Your capillary impressions become ever faster and more accurate.

From R&D to fabs: scaling up precision manufacturing

Discover NAZCA, a first-generation micro-printing machine designed for R&D laboratories.

This demonstrator democratizes access to sub-micron fabrication and defect repair, and is already installed in Europe, Asia, and the United States — including Duke University, where researchers produced the first fully recyclable, sub-micrometre printed electronics, published in Nature Electronics.

NAZCA bridges the gap between research and industry, enabling prototyping, testing, and yield improvement in real-world conditions.

Development is now expanding to Japan, Taiwan, and South Korea, where semiconductor yield management is a top priority. Hummink is currently under qualification with major display manufacturer with early tests showing yield improvements of approximately 10%.

Hummink plans to double its workforce by 2026, driven by strong demand for its printing modules and proprietary conductive inks. The company expects to double its revenue by year-end, with a business model combining:

  • Industrial printing modules (HPCaP) for in-line integration
  • Proprietary conductive inks with recurring revenue streams
  • R&D systems (NAZCA) for laboratory environments

Towards a more sustainable and efficient advanced manufacturing

Yield improvement is not just a question of performance — it’s an environmental challenge.

Correcting defects in your electronic components means avoiding the disposal of entire batches, saving materials, and reducing energy consumption.

Each drop of ink used by our printers is optimized, ensuring maximum precision with minimal waste.

You contribute to a more sustainable industry — combining efficiency, responsibility, and innovation.

"Precision is not just performance — it's sustainability."

The Bottom Line: turn microscopic flaws into a competitive advantage

In advanced manufacturing, every microscopic flaw impacts yield, costs, and sustainability. Hummink offers a new way to turn these flaws into value through its High-Precision Capillary Printing (HPCaP) technology.

With Hummink, manufacturers and innovators can:

HPCaP for Repair
  • Improve semiconductor yield by repairing microscopic defects in real time, directly on chips and displays.
  • Reduce material waste and production losses, cutting costs and supporting sustainability goals.
  • Extend product lifetimes and reliability across electronics and packaging lines.
  • Empower R&D and prototyping with sub-micron precision on any substrate.
  • Enable new design possibilities in high-value markets such as luxury, photonics, and advanced optics.

Hummink turns precision into performance — and performance into a more sustainable industry.

FAQ: micro-print and yield improvement

What is High-Precision Capillary Printing?

Inspired by Atomic Force Microscopy (AFM), High-Precision Capillary Printing (HPCaP) uses capillary forces to oscillate a micropen filled with a specific ink at high speed, depositing functional materials with sub-micron precision on a wide range of substrates. It supports the development of advanced electronic components such as semiconductor packaging interconnects and displays.

All industries that require high precision in the manufacture of small components will appreciate working with micro-print technology. Fast, flexible, and versatile, it repairs, modifies, or decorates any type of material according to your customized program, in small, medium, or large production runs. It is used particularly in small packaging manufacturing, and the application of ultra-thin polymers in the watchmaking industry.

Micro-print technology assists you with corrective tasks that cannot be handled manually or by your own production systems. The resolution of our micro-pens ranges from 50µm to a few hundred nanometres, without satellite drops or splashes.

About the Author

AM

Amin M'Barki

CEO & Co-founder at Hummink

Amin M’Barki is the visionary leader behind Hummink’s revolutionary HPCaP technology. With over 15 years of experience in nanotechnology and advanced manufacturing, he has pioneered breakthrough solutions for microscopic precision in semiconductor fabrication. Under his leadership, Hummink has secured €15M in Series B funding to transform yield improvement across the global semiconductor industry.

PhD in Nanotechnology, École Polytechnique
Former Research Director at CEA-Leti
25+ Patents in Micro-printing Technology

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