Redefining yield improvement through real-time microscopic repair.
How can manufacturers enhance precision and minimize losses as technologies continue to shrink?
Hummink’s High-Precision Capillary Printing (HPCaP) repairs, functionalizes, and decorates components at the micron scale — meeting the performance and sustainability challenges of modern industries.
Our patented micro-printing technology acts like the world’s smallest fountain pen, capable of depositing materials with sub-micron accuracy. Master the material in your processes, focus on improving semiconductor manufacturing yield, and repair microscopic defects in real time. Power the next generation of chips and displays — and design the future of nanoelectronic devices with Hummink.
Discover how HPCaP technology can revolutionize your production line
This funding round comes at a pivotal moment, as the semiconductor industry faces unprecedented pressure to improve yields amid soaring AI chip demand, rising fab costs (>$20B per leading-edge facility), and tightening sustainability regulations.
As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-dollar problems. Each defect at the sub-micron scale can derail an entire batch of chips or displays.
This funding round highlights the strategic importance of precision manufacturing for the semiconductor and display industries, where even minor defects can have a significant economic impact.
This new investment validates a key industrial need: addressing microscopic flaws that cause billions of dollars in losses across global semiconductor fabrication facilities (fabs).
To improve the yield of semiconductors, sensors, and chips, Hummink has raised €15 million to deploy its patented High-Precision Capillary Printing (HPCaP) technology.
The goal is to print functional materials on any substrate and repair microscopic defects in real-time in advanced manufacturing.
This innovative project addresses a global industrial challenge and is supported by leading investors — KBC Focus Fund, Bpifrance Deeptech Ventures, Elaia, Cap Horn, and BEI.
"Our mission is to bring precision where it has never been possible before."
Amin M'Barki, CEO
Micro-defects cost the electronics industry billions of euros. Up to 30% of OLED screens produced each year are rejected, resulting in approximately €16 billion in losses, enough wasted material to cover 6,000 football fields. All it takes is an open circuit, dead pixels, or a dark spot on a panel to compromise quality.
Traditional repair methods remain the workhorse of electronics production, but even the best processes generate flaws that lead to yield losses and material waste. In comparison, Hummink’s printing tools act as surgical instruments at the micronic level, complementing lithography by identifying and correcting those flaws in semiconductor packaging interconnects. The result is higher output, lower scrap rates, and reduced environmental impact across the industry.
With the explosion of AI chip demand, yield improvement has become a critical economic imperative—delivering higher output, lower costs, and reduced waste in advanced manufacturing.
Hummink’s patented High-Precision Capillary Printing (HPCaP) technology works like the world’s smallest fountain pen, enabling the localised deposition of conductive or functional materials with sub-micron accuracy directly onto semiconductor packaging interconnects and display components.
High-Precision Capillary Printing (HPCaP) leverages direct-write additive manufacturing. It uses a micropen that prints your patterns in a single step with a resolution from 50µm to a few hundred nanometres, on a wide range of substrates (metal, plastic, glass, paper, etc.), including flexible, curved, or 3D surfaces, making it ideal for high-precision electronics.
Discover the world’s smallest fountain pen capable of repairing micro-defects in under 2 seconds per defect, or improving semiconductor packaging and next-generation memory, directly on your production line. Fully modular, it integrates seamlessly into your existing processes.
Precision drives progress in advanced electronics. Hummink’s HPCaP technology improves semiconductor packaging manufacturing yield and enhances production efficiency in next-generation displays.
Because even the slightest defect on a screen or circuit can be fatal, industries require reliable and adaptable repair technologies.
Micro-printing has the advantage of versatility — it offers unparalleled design freedom and compatibility with multiple inks and substrates, including paper, plastic, aluminum foil, metal, and glass.
Additionally, our integrated AI tools continually enhance your system, featuring intelligent trajectory plotting, advanced image recognition, and ink monitoring. Your capillary impressions become ever faster and more accurate.
Discover NAZCA, a first-generation micro-printing machine designed for R&D laboratories.
This demonstrator democratizes access to sub-micron fabrication and defect repair, and is already installed in Europe, Asia, and the United States — including Duke University, where researchers produced the first fully recyclable, sub-micrometre printed electronics, published in Nature Electronics.
NAZCA bridges the gap between research and industry, enabling prototyping, testing, and yield improvement in real-world conditions.
Development is now expanding to Japan, Taiwan, and South Korea, where semiconductor yield management is a top priority. Hummink is currently under qualification with major display manufacturer with early tests showing yield improvements of approximately 10%.
Hummink plans to double its workforce by 2026, driven by strong demand for its printing modules and proprietary conductive inks. The company expects to double its revenue by year-end, with a business model combining:
Yield improvement is not just a question of performance — it’s an environmental challenge.
Correcting defects in your electronic components means avoiding the disposal of entire batches, saving materials, and reducing energy consumption.
Each drop of ink used by our printers is optimized, ensuring maximum precision with minimal waste.
You contribute to a more sustainable industry — combining efficiency, responsibility, and innovation.
"Precision is not just performance — it's sustainability."
Pascal Boncenne, COO
In advanced manufacturing, every microscopic flaw impacts yield, costs, and sustainability. Hummink offers a new way to turn these flaws into value through its High-Precision Capillary Printing (HPCaP) technology.
Hummink turns precision into performance — and performance into a more sustainable industry.
Inspired by Atomic Force Microscopy (AFM), High-Precision Capillary Printing (HPCaP) uses capillary forces to oscillate a micropen filled with a specific ink at high speed, depositing functional materials with sub-micron precision on a wide range of substrates. It supports the development of advanced electronic components such as semiconductor packaging interconnects and displays.
All industries that require high precision in the manufacture of small components will appreciate working with micro-print technology. Fast, flexible, and versatile, it repairs, modifies, or decorates any type of material according to your customized program, in small, medium, or large production runs. It is used particularly in small packaging manufacturing, and the application of ultra-thin polymers in the watchmaking industry.
Micro-print technology assists you with corrective tasks that cannot be handled manually or by your own production systems. The resolution of our micro-pens ranges from 50µm to a few hundred nanometres, without satellite drops or splashes.
CEO & Co-founder at Hummink
Amin M’Barki is the visionary leader behind Hummink’s revolutionary HPCaP technology. With over 15 years of experience in nanotechnology and advanced manufacturing, he has pioneered breakthrough solutions for microscopic precision in semiconductor fabrication. Under his leadership, Hummink has secured €15M in Series B funding to transform yield improvement across the global semiconductor industry.
Join leading manufacturers already using HPCaP technology to improve yields, reduce waste, and drive innovation at the microscopic scale.