Field of application

Display & Display Repair

HPCaP enables targeted deposition of inks on display substrates, for production and defect repair

Market challenges

A resolution gap for open defect repair

TFT structures are now smaller than 5 μm, while the smallest open defects that existing technologies can repair measure 5 μm. Repair capability no longer matches panel resolution.

No industrial solution is available yet

Display manufacturers need repair that combines precision, throughput, and repeatability at production scale. No available solution meets all three today.

Particle contamination defects remain out of reach

Defects caused by particle contamination during manufacturing cannot currently be repaired. Addressing them would widen the range of recoverable panels.

Scrap and redundancy as the default response

Defective panels are discarded or compensated with redundancy, meaning spare components and backup circuits. Redundancy takes up panel space and limits layout optimization.

SEM image of parallel lines printed with HPCaP, widths around 600 nm

How HPCaP addresses them

Resolution matched to TFT structures

HPCaP is qualified down to 2 μm, below the 5 μm limit of existing repair technologies. Open defects can be repaired at the scale of current TFT structures.

Functional metal deposition on any substrate

HPCaP deposits metal with an electrical conductivity of up to 30% of the bulk material. Automatic calibration follows the topography of the substrate, so the process adapts to different surfaces and conductivities.

Open defect repair and cavity filling in one tool

The same technology repairs open defects and fills cavities, including in the planarization layer.

Repair at several manufacturing steps

HPCaP can be applied at multiple stages of display fabrication, for OLED, microLED, and LCD. Repairing the defect directly frees the space used by redundancy and helps preserve display performance.