Applications

Opening up to a wider range of manufacturing perspectives

Applications Hummink

Applications

Boosting the semiconductor industry

The semiconductor industry is the physical engine of growing digital applications: AI, Cloud, 5G, quantum, microLED, space. But the industry is mostly held back by a manufacturing challenge: assembling ever more complex and miniaturized components.

Humnink has been collaborating with world-renowned industrial R&D partners to address these challenges with concrete applications.

CEA Leti

CEA Leti is a key European player in research, development and innovation in the semiconductor industry.

Together, we have been developing new solutions for advanced packaging and transparent conductive oxydes manufacturing.

CNES

CNES is the French National Center of Space Studies. It guides innovations for the aerospace and defense industries.

We have been collaborating on micro-electronics applications (sensors, interconnects, etc.)

Université Paris Cité

Itodys Lab from Université Paris Cité is a printed electronics specialist with deep industrial connections.

Collaborating on printed electronic topics (graphene transistors, bio-sensors, nano-catalysts), and acquirers of the 1st Nazca machine in 2022.

Want to draw micronic or sub-micronic patterns?

Meet NAZCA

USE CASES

ON-DEMAND INTERCONNECT OR REPAIR

Challenge

Build targeted soldering connections between miniaturized components

Solution

One-step manufacturing of silver/copper interconnect on PCB with 10 um resolution

ON-DEMAND INTERCONNECT OR REPAIR
ADVANCED PACKAGING

ADVANCED PACKAGING

Challenge

On-demand 3D Bumps for Flip-Chip Applications

Solution

Patented One-step manufacturing of silver/copper 3D bump on PCB with 30 um diameter (basis) and 50 um height (controlled aspect ratio)

REDISTRIBUTION LAYERS

Challenge

On-demand conductive lines manufacturing with controlled spacing

Solution

One-step manufacturing of silver lines on Si Wafer,
1 um line width, 2 um spacing

Redistribution layers
Biosensors

BIOSENSORS

Challenge

Reach out to sub-micronic metallic lines with controlled spacing between them

Solution

Silver ink deposition on Si Wafer, 460 nm line width, 600 nm spacing

WAVEGUIDES / ANTENNAS

Challenge

Design waveguides with sub-500 nm wavelength

Solution

SU8 deposition on glass, with 340 nm period

Waveguides
Transparent conductive oxydes

TRANSPARENT CONDUCTIVE OXIDES

Challenge

On demand metallic gratings

Solution

Silver line grating, 1 um resolution

MICRO-LED MANUFACTURING AND REPAIR

Challenge

Manufacturing of micronic resolution for quantum dots deposition with controlled spacing

Solution

Graphene QD deposition, 1 um resolution,
5 um spacing

Micro-led manufacturing and repair

Want to know how we do it?

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