Opening up to a wider range of manufacturing perspectives

Applications Hummink


Boosting the semiconductor industry

The semiconductor industry is the physical engine of growing digital applications: AI, Cloud, 5G, quantum, microLED, space. But the industry is mostly held back by a manufacturing challenge: assembling ever more complex and miniaturized components.

Hummink has been collaborating with world-renowned industrial R&D partners to address these challenges with concrete applications.

CEA Leti

CEA Leti is a key European player in research, development and innovation in the semiconductor industry.

Together, we have been developing new solutions for advanced packaging and transparent conductive oxydes manufacturing.


CNES is the French National Center of Space Studies. It guides innovations for the aerospace and defense industries.

We have been collaborating on micro-electronics applications (sensors, interconnects, etc.)

Université Paris Cité

Itodys Lab from Université Paris Cité is a printed electronics specialist with deep industrial connections.

Collaborating on printed electronic topics (graphene transistors, bio-sensors, nano-catalysts), and acquirers of the 1st Nazca machine in 2022.

Want to draw micronic or sub-micronic patterns?





Industry is looking to technical solutions able to repair new generation of thin film transistors (TFT) and color converters with high precision at micron scale. Conventional methods, as inkjet and laser repair, are failing at this scale.

HPCAP Benefit

HPCAP printing is the perfect solution to repair displays with high precision, as it fully removes satellite drops and particles generated by inkjet and laser technologies.  



flip chip


High aspect ratio microbumps with diameters less than 5 µm are required to reach high density pixels and to reduce pixel-to-pixel coupling noise. Those dimensions are not available using conventional technologies.

HPCAP Benefit

High density and aspect ratio microbumps are manufactured in one step, with a perfect control of bumps dimension and shape. 



Watchmaking industry is actively looking to print ultra-thin polymers, able to survive to very aggressive chemical and mechanical  environments. 

HPCAP Benefit

Hummink technology delivers high precision printing for a wide range of inks, including high viscosity (up to 100,000 cP) and polymer-based chemistries.





Electrolyte-gated organic field effect transistors (EGOFET) is the ideal technology to detect molecules in liquid media. To meet biosensor specifications, the distance between electrodes has to be reduced to improve signal output.

HPCAP Benefit

HPCAP printing represents a highly cost-effective, user-friendly and versatile method for the fabrication of superior EGOFETs, with an excellent signal output and a sub micron distance between electrodes. 



As a highly customizable additive manufacturing method, printing enables a high degree of freedom in testing ideas and concepts for new devices by varying design parameters. Waveguides have proved difficult to create with inkjet printing methods, because of their limited precision and satellite drops.

HPCAP Benefit

Hummink technology is able to print the most complex patterns with high precision at sub-micron scale.


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