Applications
Opening up to a wider range of manufacturing perspectives
Applications
Boosting the semiconductor industry
The semiconductor industry is the physical engine of growing digital applications: AI, Cloud, 5G, quantum, microLED, space. But the industry is mostly held back by a manufacturing challenge: assembling ever more complex and miniaturized components.
Humnink has been collaborating with world-renowned industrial R&D partners to address these challenges with concrete applications.
CEA Leti is a key European player in research, development and innovation in the semiconductor industry.
Together, we have been developing new solutions for advanced packaging and transparent conductive oxydes manufacturing.
CNES is the French National Center of Space Studies. It guides innovations for the aerospace and defense industries.
We have been collaborating on micro-electronics applications (sensors, interconnects, etc.)
Itodys Lab from Université Paris Cité is a printed electronics specialist with deep industrial connections.
Collaborating on printed electronic topics (graphene transistors, bio-sensors, nano-catalysts), and acquirers of the 1st Nazca machine in 2022.
Want to draw micronic or sub-micronic patterns?
Meet NAZCAUSE CASES
ON-DEMAND INTERCONNECT OR REPAIR
Challenge
Build targeted soldering connections between miniaturized components
Solution
One-step manufacturing of silver/copper interconnect on PCB with 10 um resolution
ADVANCED PACKAGING
Challenge
On-demand 3D Bumps for Flip-Chip Applications
Solution
Patented One-step manufacturing of silver/copper 3D bump on PCB with 30 um diameter (basis) and 50 um height (controlled aspect ratio)
REDISTRIBUTION LAYERS
Challenge
On-demand conductive lines manufacturing with controlled spacing
Solution
One-step manufacturing of silver lines on Si Wafer,
1 um line width, 2 um spacing
BIOSENSORS
Challenge
Reach out to sub-micronic metallic lines with controlled spacing between them
Solution
Silver ink deposition on Si Wafer, 460 nm line width, 600 nm spacing
WAVEGUIDES / ANTENNAS
Challenge
Design waveguides with sub-500 nm wavelength
Solution
SU8 deposition on glass, with 340 nm period
TRANSPARENT CONDUCTIVE OXIDES
Challenge
On demand metallic gratings
Solution
Silver line grating, 1 um resolution
MICRO-LED MANUFACTURING AND REPAIR
Challenge
Manufacturing of micronic resolution for quantum dots deposition with controlled spacing
Solution
Graphene QD deposition, 1 um resolution,
5 um spacing
