SEMICON Europa 2026
Messe München | November 10-13 | Hall C1 – Booth 1370
The first industrial HPCaP solution for micro-scale deposition, designed to improve manufacturing yields
As advanced packaging plays an increasingly important role in the performance and miniaturization of electronic components, manufacturers face growing challenges in terms of yield, precision, and integration.
As the developer and exclusive provider of High Precision Capillary Printing (HPCaP) technology, Hummink introduces BIRD module (Breakthrough Integration and Resolution in Defect Repair).
Having already demonstrated its capabilities in research and development environments, HPCaP technology is now being deployed in pilot phase on display manufacturing lines, with semiconductor manufacturing and advanced packaging as the next areas of application. BIRD brings micron-scale printing, defect repair, and surface functionalization capabilities directly into the manufacturing process.
“A single RDL defect on a high-value panel can jeopardize the production of dozens of AI chips. With BIRD, we are introducing a repair technology that acts as a surgical tool on the production floor. HPCaP technology enables advanced packaging manufacturers to enhance their yields.”
Reducing yield losses layer by layer: a critical challenge for advanced packaging
In advanced packaging, a single RDL defect can lead to the scrapping of an entire panel. As the industry moves toward Fan-Out Panel-Level Packaging (FOPLP) to meet advanced packaging demands, increasingly complex architectures and finer RDL lines are creating unprecedented yield challenges.
Where a defect can be repaired rather than scrapped, the value recovered can reach tens of thousands of euros per substrate. This is especially important for manufacturers in the information and communications technology (ICT), AI, and multi-chip architecture sectors.
Key specifications
Designed for integration into production lines, the BIRD module enables:
- Micron-scale printing from 0.6 to 50 µm;
- Localized material deposition and defect repair;
- Surface functionalization.
Performance specifications:
- Compatibility with conductive, dielectric, and functional inks up to 250,000 cP;
- Compatibility with glass and a wide range of substrates.
With Hummink's direct additive HPCaP process, the entire manufacturing cycle, from design to finished part, takes only a few minutes. It relies on direct, maskless deposition followed by local laser sintering.
This targeted deposition process reduces material and chemical consumption. In terms of yield, the ability to repair defects also minimizes the number of parts that need to be scrapped.
Pilot line now underway in Asia
BIRD is currently in pilot line at a major semiconductor and display manufacturer in Asia. This marks the module’s first deployment in an advanced manufacturing environment, where defect repair and the reduction of yield losses are key priorities.
Meet Hummink at SEMICON Europa 2026
The Hummink team will unveil the BIRD module from November 10 to 13 at SEMICON Europa 2026, at Messe München, Hall C1, Booth 1370.
