Break the 5 µm wall with 
Meet BIRD, our HPCaP industrial printing module, designed to integrate directly into your production line.
BIRD stands for Breakthrough Integration and Resolution in Defect Repair
In high-value manufacturing, a single micro-defect can send a whole component to scrap. Repairing defects where they occur can enhance yield. The BIRD module makes this possible by bringing HPCaP printing into your production line, with no standalone machine required.
It adds micro- and nanoscale printing, repair, and functionalization to your process at industrial scale, without disrupting the line. BIRD is designed for integration in semiconductor, advanced packaging, display, and biosensor manufacturing.
BIRD key features
Resolution & precision
From 80 to 0.6 µm
XY POSITION ACCURACY
500 nm
MAXIMUM PRINTING RANGE
PRINT SPEED
Versatile materials platform
Silver, gold, copper, graphene, polymers, and more, all on the same machine
Substrate adaptability
Any type, e.g. Panel (up to Gen 8.6), Wafer (up to 300 mm)
Shape & pattern freedom
Lines, circles, gratings, dots, and 3D pillars, all in one process
Viscosity range
From 1 to 550,000 cP, a range inkjet can’t touch
Print with BIRD in 6 steps:
integrated and automated
workflow
The system automatically initializes and calibrates all subsystems, including the pipette, for mass production conditions.
The panel to repair is loaded and ready for processing.
The gantry moves the BIRD Module precisely to the defect zone.
The defect is inspected with the integrated high resolution camera, and the repair pattern is designed to match it perfectly.
The pipette deposits the ink to repair the inspected defect with sub-micron precision.
The repaired area is inspected to confirm the success of the repair operation. Move to the next defect within the panel or to the next panel.
Initialization & calibration
Load the panel to repair
Move to the defect zone
Inspection & pattern design
Print & repair
Inspect & validate the print
Specs are only half the story.
Here’s what makes BIRD effortless to run.
All-in-one
intuitive software
BIRD module’s software integrates directly with your existing machines: no retooling, no separate system to manage.
Built-in computer vision automatically locates and aligns to the substrate, so positioning is precise and hands-off, every run.
Operators see exactly what’s happening in real time: clear status, live data, no need to interpret raw output.
Software that fits your existing lines
Automated positioning, powered by computer vision
Live monitoring, built for operators
Add precision printing to your line, not a new machine
BIRD module integrates directly into your existing production line.
Integrating the process in-line means tighter quality control, real-time defect repair, and lower cost per unit than adding a separate inspection or rework step ever could.
No standalone equipment
No line reconfiguration
No trade-off between precision and throughput
Sustainable and efficient printing, built into your line
Zero material waste
Full pipette utilization, vs. up to 30% lost in photolithography
One step, start to finish
Design straight to printed part in a single additive pass. No masks, no sequencing
Less chemicals
Print without a cleanroom, solvents, or ultrapure water. Cleaner by design
Minutes, not hours
From design to finished print in about 30 minutes
In-line defect repair
Extends product life instead of adding to the 62 million tonnes of e-waste generated worldwide each year
Where BIRD Module fits
Frequently asked questions
Can the BIRD module be integrated into existing OEM equipment?
Yes, BIRD is designed for integration into OEM systems. Integration requirements are evaluated based on the equipment architecture, communication protocols, and application needs.
What printing resolution and accuracy can BIRD achieve?
BIRD supports printing feature sizes from 80 µm down to 0.6 µm, with XY positioning accuracy of 500 nm. These capabilities enable precise material deposition for advanced manufacturing applications.
Can the BIRD module be customized for specific applications?
Yes, BIRD can be evaluated for customer-specific requirements, including printing configurations, material compatibility, and integration constraints, subject to technical feasibility.
Does BIRD offer automated printing capabilities for an industrial production environment?
Yes. BIRD integrates high-resolution imaging and computer vision software for alignment, automatic system calibration, automatic pipette approach, and real-time monitoring of the printing process. This automation makes the process compatible with mass production.
Is there any panel or wafer size limitation with BIRD?
No. BIRD is designed for integration onto an OEM gantry, so the maximum panel or wafer size is set by the gantry, not by the module.
Is there any risk in using BIRD in a cleanroom environment (such as a semiconductor fab)?
No. BIRD is fully compatible with cleanroom environments and complies with cleanroom operation requirements, making it suitable for use in semiconductor fabrication facilities.
What is the uptime of the BIRD tool?
The module is designed for high availability, with a typical uptime exceeding 90%.
Get started
Bring BIRD module into your line
Ready to see BIRD print your design? Tell us about your project below.